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RE46C803SS20
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Microchip Technology |
CO COMP, LOW CURRENT |
20-SSOP (0.209", 5.30mm Width) |
22,992 piece(s) |
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RE46C803SS20T
|
Microchip Technology |
CO COMP, LOW CURRENT |
20-SSOP (0.209", 5.30mm Width) |
14,772 piece(s) |
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PGA460TPWQ1
|
Texas Instruments |
AUTOMOTIVE ULTRASONIC SIGNAL PRO |
16-TSSOP (0.173", 4.40mm Width) |
7,044 piece(s) |
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PGA305ARHHT
|
Texas Instruments |
PGA305 SMALL REEL SETUP |
32-VFQFN Exposed Pad |
6,888 piece(s) |
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MCP96L00-E/MX
|
Microchip Technology |
+/- 4.0C THERMOCOUPLE TO I2C CON |
20-VQFN Exposed Pad |
10,188 piece(s) |
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BU21077MUV-E2
|
Rohm Semiconductor |
CAPACITIVE SWITCH CONTROLLER IC |
20-VFQFN Exposed Pad |
3,376 piece(s) |
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BU21170MUV-E2
|
Rohm Semiconductor |
CAPACITIVE SWITCH CONTROLLER IC |
20-VFQFN Exposed Pad |
3,312 piece(s) |
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BU21078FV-E2
|
Rohm Semiconductor |
CAPACITIVE SWITCH CONTROLLER ICS |
28-TSSOP (0.220", 5.60mm Width) |
6,688 piece(s) |
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ADPD1080BCPZ
|
Analog Devices Inc. |
PWR MGMT SUPERVISORY |
28-WFQFN Exposed Pad |
8,172 piece(s) |
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ISL29501IRZ-T7A
|
Renesas Electronics America |
IC TOF SIGNAL PROCESSOR 24QFN |
24-VFQFN Exposed Pad |
5,952 piece(s) |
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MAX22195ATJ+
|
Maxim Integrated |
IC OCTAL TRANSLATOR 32TQFN |
32-WFQFN Exposed Pad |
6,732 piece(s) |
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TDC-GP22 TRA
|
ams |
ULTRASONIC FLOW SENSOR 32QFN |
32-VFQFN Exposed Pad |
7,896 piece(s) |
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TDC-GP30YA-F01 3K
|
ams |
IC ULTRASONIC FLOW SENSOR 40QFN |
40-VFQFN Exposed Pad |
2,272 piece(s) |
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TDC-GP30YD-F01 3K
|
ams |
IC ULTRASONIC FLOW SENSOR 32QFN |
32-VFQFN Exposed Pad |
4,608 piece(s) |
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PGA302EPWT
|
Texas Instruments |
SENSOR SIGNAL CONDITIONER WITH 0 |
16-TSSOP (0.173", 4.40mm Width) |
4,080 piece(s) |
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HIP9011ABZT
|
Renesas Electronics America |
IC SENSOR ENGINE KNOCK 20-SOIC |
20-SOIC (0.295", 7.50mm Width) |
27,084 piece(s) |
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PGA302EPWR
|
Texas Instruments |
PRESSURE SENSOR SIGNAL CONDITION |
16-TSSOP (0.173", 4.40mm Width) |
5,280 piece(s) |
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IS31SE5104-GRLS2-TR
|
ISSI, Integrated Silicon Solution Inc |
IC TOUCH SENSOR CAP 4CH 16SOP 6M |
16-SOIC (0.154", 3.90mm Width) |
7,408 piece(s) |
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MLX75123RLA-ABA-000-SP
|
Melexis Technologies NV |
AUTOMOTIVE TOF COMPANION CHIP |
84-VFQFN Dual Rows, Exposed Pad |
7,808 piece(s) |
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MAX22192ARC+
|
Maxim Integrated |
ISOLATED, INDUSTRIAL DIGITAL INP |
70-LFBGA |
5,472 piece(s) |
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MAX12900AATJ+
|
Maxim Integrated |
4-20MA ANALOG BACKEND |
32-WFQFN Exposed Pad |
6,048 piece(s) |
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HIP9011ABZ
|
Renesas Electronics America |
IC SENSOR ENGINE KNOCK 20-SOIC |
20-SOIC (0.295", 7.50mm Width) |
5,504 piece(s) |
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TDC-GP21 1K
|
ams |
TDC-GP21 1K VQFN32 LF T&R |
32-VFQFN Exposed Pad |
4,736 piece(s) |
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TDC-GP22 1K T&R
|
ams |
TDC-GP22 1K QFN32 LF T&R |
32-VFQFN Exposed Pad |
7,120 piece(s) |
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